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Glass Transition Temperature, Tg The Tg of a resin system is the temperature at which the material transforms from a relatively rigid or glassy state, to a more deformable or softened state.This is a thermodynamic change in the material which is reversible as long as the resin system has not been degraded. This is to say that when a material that has been heated above its Tg is cooled back below the Tg, it returns to a more rigid state with essentially the same properties as before. However, if the material is heated to too high a temperature beyond Tg, irreversible changes in properties may result. The temperature at which this will happen varies by material type and is related to resin decomposition, discussed later.

A material is not in a liquid state when it is above the Tg, as some discussions of Tg imply. It is a temperature at which physical changes take place due to the weakening of molecular bonds within the material. It is important to understand Tg since the properties of base materials are different above Tg than below Tg. While the Tg is typically described as being a very precise temperature, this is somewhat misleading, because the physical properties of the material can begin to change as the Tg is approached and some of the Tg molecular bonds are affected. As the temperature increases, Temperature more of the bonds become weakened until for all practical purposes, all relevant bonds are affected. This explains the FIGURE 6.1 Glass transition temperature by TMA. curved line in Fig. 6.1, which is discussed in the following text. The Tg of a resin system has several important implications. These include:

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6.3.1.1 Thermal Expansion. All materials will undergo changes in physical dimensions in response to changes in temperature. The rate at which the material expands is much lower below the Tg than above. Thermomechanical analysis (TMA) is a procedure used to measure dimensional changes versus temperature. Extrapolating the linear portions of the curve to the point at which they intersect provides a measure of the Tg (see Fig. 6.1). The slopes of the linear portions of the curve above and below the Tg represent the respective rates of thermal expansion, or as they are typically called, the coefficients of thermal expansion (CTEs). CTE values are important since they influence the reliability of the finished circuit. Other things being equal, less thermal expansion will result in greater circuit reliability as less stress is applied to plated holes. 6.3.1.2 Degree of Cure. The resin systems used in base materials begin with subcomponents that contain reactive sites on their molecular structures. The application of heat to the resin system and curing agents causes the reactive sites to cross-link or bond together. This process of curing the resin system brings about physical changes in the material in proportion to the degree to which the cross-linking occurs, including increases in the Tg.When most of the reactive sites have cross-linked, the material is said to be fully cured and its ultimate physical properties will be established. Besides TMA, two other thermal analysis techniques are also commonly used for measuring Tg and degree of cure: differential scanning calorimetry (DSC) and dynamic mechanical analysis (DMA).

DSC measures heat flow versus temperature rather than the dimensional changes measured by TMA.The heat absorbed or given off will also change as the temperature increases through the Tg of the resin system.Tg measured by DSC is often somewhat higher than measurements by TMA. DMA measures the modulus of the material versus changes in temperature, and also will give somewhat higher values for Tg.

Materials that are not fully cured can cause problems in circuit manufacturing processes and with finished circuit reliability. For example, an undercured multilayer circuit at the drilling process can result in excessive resin smear across the internal circuit connections in

IIC or I2C: Acronym for Inter-IC communication A communication bus with only two signals infrared: Part of the light spectrum that is just above that of visible light in the red end of the spectrum IrDA: Acronym for Infrared Data Association IrDA is an industry-sponsored organization to design standards for the hardware and software used in infrared communication links instruction: Lowest level command given to the processor by a program interrupt: An asynchronous signal generated by a peripheral device to the processor that, when asserted, indicates to the processor to take notice and execute a special piece of program called an ISR I/O: Input Output Peripheral devices of a processor to interact with the physical environment around it I/O map: A table containing the addresses, within the I/O space, of the input and output devices of a computer system.

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