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21. Thwaites, C. J., Soft Soldering, Gold Plating Technology, Electrochemical Publications, 1974, ch. 19, pp. 225 245. 22. Karnowsky, M., Rosenweig, A., Trans. Met. Soc. Am. Inst. Min. Engrs, 242, 2257 1958. 23. Fox, A., et al., The Effect of Gold-Tin Intermetallic Compound on the Low Cycle Fatigue Behavior of Copper Alloy C72700 and C17200 Wires, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. CHMT-9, No. 3, September 1986, pp. 272 278. 24. Prince, A., The Au-Pb-Sn Ternary System, Journal of Less-Common Metals, 12, pp. 107 116, 1967. 25. Shewmon, P., Diffusion in Solids, McGraw-Hill, 1963, pp. 115 136. 26. Seitz, F., On the Porosity Observed by the Kirkendall Effect, Acta Metallurgica, Vol. 1, 1953, p. 355. 27. Zakel, E., and Reichl, H., Au-Sn Bonding Metallurgy TAB Contacts and Its Influence on the Kirkendall Effect in Ternary Cu-Au-Sn System, Proceedings of the 42nd Electronic Components & Technology Conference, May 1992, pp. 360 371. 28. Haimovich, J., Intermetallic Compound Growth in Tin and Tin-Lead Platings, NWC TP 6896, EMPF TP 0003. 29. Moltz, E., Use and Handling of Semiconductor Packages with ENIG Pad Finishes, Texas Instruments Application Report SPRAA55, August 2004. 30. Bryant, K., Investigating Voids, Circuits Assembly, June 2004, pp. 18 20. 31. Yau, Y-H, et al., The Properties of Immersion Silver Coating for Printed Wiring Boards, IPC/APEX, Anaheim, 2005. 32. Aspandiar, R., Voids in Solder Joints, IPC/CCA PCB Assembly and Test Symposium, May, 2005. .net pdf 417 PDF - 417 C# Control - PDF - 417 barcode generator with free C# ...
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